Multilevel interconnect reliability on the effects of electro - thermomechanical stresses : Dessertation /

Saved in:
Bibliographic Details
Main Author: Nguyen, Van Hieu
Format: Book
Language:English
Published: Netgerlands : [s.n.], 2004.
Subjects:
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Physical Description:135 tr. ; 24 cm.
ISBN:9036520290