Wire Bonding Microelectronics : Materials, Process, Reliability an Yield /
Saved in:
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Book |
| Language: | English |
| Published: |
United States :
McGraw - Hill,
1997.
|
| Subjects: | |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| LEADER | 01065nam a22002417a 4500 | ||
|---|---|---|---|
| 005 | 20200501230735.0 | ||
| 008 | 200404s1997 xxu|||||||||||||||||eng|| | ||
| 020 | |a 0070326193 : |c 65.00 USD | ||
| 040 | |a Phenikaa-Uni |b vie |c Phenikaa-Uni |e aacr2 | ||
| 041 | 0 | |a eng | |
| 044 | |a xxu | ||
| 082 | 0 | 4 | |2 23 |a 621.381 |b W313E 1997 |
| 100 | 1 | |a Harman, George . | |
| 245 | 1 | 0 | |a Wire Bonding Microelectronics : |b Materials, Process, Reliability an Yield / |c George Harman, Charles A. Harper |
| 260 | |a United States : |b McGraw - Hill, |c 1997. | ||
| 300 | |a 290 tr. ; |c 24 cm. | ||
| 650 | 0 | 4 | |a Điện tử |
| 650 | 0 | 4 | |a Vi điện tử |
| 650 | 0 | 4 | |a Wire Bonding Microelectronics |
| 700 | 1 | |a Harper, Charles A. | |
| 942 | |2 ddc |c SACH | ||
| 999 | |c 2729 |d 2729 | ||
| 952 | |0 1 |1 0 |2 ddc |4 0 |6 621_381000000000000_W313E_1997 |7 0 |9 11341 |a PHENIKAA |b PHENIKAA |c PNK_105 |d 2020-04-15 |g 999999.99 |l 0 |o 621.381 W313E 1997 |p 00009634 |r 2020-04-15 |v 999999.99 |w 2020-04-15 |x Sách các khoa cho TV mượn PV kiểm định, trả về cho Khoa |y SACH |x Sách các khoa cho TV mượn PV kiểm định, trả về cho Khoa | ||