APA Citation

Harman, G. .., & Harper, C. A. (1997). Wire Bonding Microelectronics: Materials, Process, Reliability an Yield. United States: McGraw - Hill.

Chicago Style Citation

Harman, George ., and Charles A. Harper. Wire Bonding Microelectronics: Materials, Process, Reliability an Yield. United States: McGraw - Hill, 1997.

MLA Citation

Harman, George ., and Charles A. Harper. Wire Bonding Microelectronics: Materials, Process, Reliability an Yield. United States: McGraw - Hill, 1997.

Warning: These citations may not always be 100% accurate.