Measurement, intrumentation, and sensors handbook : spatical, mechanical, thermal, and radiation measurement /
The Second Edition of the bestselling Measurement, Instrumentation, and Sensors Handbook brings together all aspects of the design and implementation of measurement, instrumentation, and sensors. Reflecting the current state of the art, it describes the use of instruments and techniques for performi...
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| Đồng tác giả: | , |
|---|---|
| Định dạng: | Sách tham khảo chuyên ngành |
| Ngôn ngữ: | English |
| Nhà xuất bản: |
New York:
CRC Press,
2014.
|
| Phiên bản: | 2rd edition. |
| Chủ đề: | |
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| 520 | 3 | |a The Second Edition of the bestselling Measurement, Instrumentation, and Sensors Handbook brings together all aspects of the design and implementation of measurement, instrumentation, and sensors. Reflecting the current state of the art, it describes the use of instruments and techniques for performing practical measurements in engineering, physics, chemistry, and the life sciences and discusses processing systems, automatic data acquisition, reduction and analysis, operation characteristics, accuracy, errors, calibrations, and the incorporation of standards for control purposes. Organized according to measurement problem, the Spatial, Mechanical, Thermal, and Radiation Measurement volume of the Second Edition: Contains contributions from field experts, new chapters, and updates to all 96 existing chapters Covers instrumentation and measurement concepts, spatial and mechanical variables, displacement, acoustics, flow and spot velocity, radiation, wireless sensors and instrumentation, and control and human factors A concise and useful reference for engineers, scientists, academic faculty, students, designers, managers, and industry professionals involved in instrumentation and measurement research and development, Measurement, Instrumentation, and Sensors Handbook, Second Edition: Spatial, Mechanical, Thermal, and Radiation Measurement provides readers with a greater understanding of advanced applications. | |
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